Inductor Coils Engineering Kit

ATP offers Inductor Coils Engineering Kits which contain the entire ATP Inductor Coils product line in one complete package to meet your prototyping needs.

Material: 0.010 Thick quartz/fused Silica (SiO2)
Metalization A Side:
• TiW = 400 to 800 Å
• Au = 250µ" minimum
No Metalization on B Side
Critical Dimensions:
• Line = 0.0006 ±0.0001
• Gap = 0.001 ±0.0001
Polyimide = 3–6 Microns

Inquire with ATP Sales for special pricing and quick turns on the following Kit part number:
ATP-I-010-Q-ENGKIT

Download Data Sheet in PDF format.*

  Inductor Coil

Inductor Coil

Select the Request Quote button, below, to request a quote for your Engineering Transmission Lines Kit(s).

Please use this form to request your quote. Providing your email address will ensure a quick response. We will never share your information without your permission. (Privacy Policy)

Company
Address
Address
City
State/Province
Postal Code
Country
Quantity of Kits
Name
Title
Phone
Fax
Email
Comments
     
  Inductor Coils Engineering Kit
 

Each kit contains the following part numbers and quantities:

ATP Part# Inductor Turns Inductance (L) Q Part Size Quantity
ATP-I-010-Q-022 2.5 2.2nH 4.5 0.022" x 0.022" (0.559mm x 0.559mm) 10
ATP-I-010-Q-350 3.0 3.5nH 4.5 0.022" x 0.022" (0.559mm x 0.559mm) 10
ATP-I-010-Q-390 3.5 3.9nH 5.2 0.022" x 0.022" (0.559mm x 0.559mm) 10
ATP-I-010-Q-730 4.0 7.3nH 5.9 0.025" x 0.025" (0.635mm x 0.635mm) 10
ATP-I-010-Q-120 4.5 12.0nH 7.0 0.030" x 0.030" (0.762mm x 0.762mm) 10
ATP-I-010-Q-158 5.0 15.8nH 8.1 0.030" x 0.030" (0.762mm x 0.762mm) 10
ATP-I-010-Q-196 5.5 19.6nH 8.6 0.032" x 0.032" (0.813mm x 0.813mm) 10
ATP-I-010-Q-219 6.5 21.9nH 9.6 0.034" x 0.034" (0.864mm x 0.864mm) 10
ATP-I-010-Q-264 7.0 26.4nH 9.4 0.032" x 0.032" (0.813mm x 0.813mm) 10
ATP-I-010-Q-282 7.5 28.2nH 8.9 0.032" x 0.032" (0.813mm x 0.813mm) 10
ATP-I-010-Q-406 8.25 40.6nH 10.9 0.038" x 0.038" (0.965mm x 0.965mm) 10
ATP-I-010-Q-783 9.5 78.3nH 18.1 0.050" x 0.050" (1.270mm x 1.270mm) 10
ATP-I-010-Q-877 10.5 87.7nH 14.7 0.046" x 0.046" (1.168mm x 1.168mm) 10
ATP-I-010-Q-1127 12.0 112.7nH 16.9 0.052" x 0.052" (1.321mm x 1.321mm) 10

ATP offers build-to-print service for a wide range of materials and metalization schemes. ATP fabricates circuits on substrates from As-Fired Alumina to Beryllium Oxide to Fused Silica, even Silicon. Metalizations range from the standard TaN/TiW/Au to films including Nickel, Palladium, or Titanium.

At ATP, we constantly evolve our processing and material capabilities to reflect our customer’s changing needs. If you have a circuit requirement that is out of the “normal” thin-film type, please contact ATP. ATP would enjoy discussing your application with you and working to develop a solution.

*PDF documents require Adobe Reader.

Company Technologies Capabilities Design Guidelines Products Other

Introduction

Polyimide Supported Bridges

Photomasks

Standard Dimensions and Tolerances

Inductor Coils

Home

Quality Assurance System

Solder Dams

Substrates

Material and Conversion Tables

Inductor Coils Eng. Kit

Contact Us

Directions

Laser Diode Submounts (Au/Sn)

Material Specs

Thermal Performance

Microstrip Transmission Lines

Terms of Use

Employment

Vias: Plated Through

Laser Machining/Drilling-Vias

Aging Equation

Transmission Lines Eng. Kits

Privacy Policy

Sales Rep’s

Vias: Au or Cu Solid Filled

Backside Burnishing Treatment

Safe Current Limits

Stand Off/Isolation Pads

Facebook

Contact Us

Edge Wraps

Metallizations

Design Resources

ATP Bond Qualification Coupons

 
 

Gold Bumping

Integrated TaN Resistors

 

Product Samples

 
 

Fractal Fasten

Laser Resistor Trimming

 

Packaging/Chip Trays

 
   

Serialization