Vias: Plated Through

ATP offers embedded ground connections formed with via holes through the substrate material. These connections provide a convenient means of obtaining a ground return through the case of the mounting medium, without the use of cumbersome bond ribbons. Assembly concerns are also addressed by eliminating epoxy and solder bleed onto the component mounting surfaces with either polyimide or solid filled vias.

Physical Properties of Polyimide Fill
Max. Use Temp. 2800°F
Base Aluminum Oxide
Compressive Strength 4200 psi
Flexural Strength 1900 psi
Dielectric Strength 125 Volts/mil
Volume Resistance 108 Ohm cm
Thermal Conductivity 15 BTU in/hr. °F ft.2
Expansion 4.0 × 10-6/°F
Components 2.0
Mix Ratio 100 to 30 (by weight)
Consistency Paste

Manufactured according to Mil Spec MIL-I-45208

Hollow Plated, Polyimide Filled and Enforced Via Sizes
Substrate
Thickness
Preferred
Hole Diameter
Minimum Allowable
Hole Diameter
0.010" (0.254mm) 0.008–0.010" (0.202–0.254mm) 0.005" (0.127mm)
0.015" (0.381mm) 0.012–0.015" (0.305–0.381mm) 0.007" (0.177mm)
0.020" (0.508mm) 0.015–0.020" (0.381–0.508mm) 0.010" (0.254mm)
0.025" (0.635mm) 0.020–0.025" (0.508–0.635mm) 0.012" (0.305mm)
 
Cross section of Hollow Plated Via

Cross section of
Hollow Plated Via

 
Cross section of Polyimide Filled Via

Cross section of
Polyimide Filled Via

 
Cross section of Polyimide Filled Via at 200X

Cross section of
Polyimide Filled Via at 200X

       
 
Hollow Plated Via

Hollow Plated

Hollow plated vias are Laser or Ultrasonicdrilled with diameters as low as 50% of the material thickness and are available on Alumina (Al2O3), Aluminum Nitride (AlN), Beryllium Oxide (BeO) and Fused Silica/Quartz. This process can be used to create slots and castellations.

  Hollow Plated Vias

Hollow Plated Vias

 
 
Enforced Hollow Plated Via-Wrap

Enforced Hollow Plated Via-Wrap

Enforced vias are an additive process to the standard hollow plated vias. This application is used for thicker conductive metal on the wall and anchor ends of the via holes. This process will ensure increased stability and conductivity. Metal overlaps over existing standard metallizations. The metal via wrap on the surface can be a minimum of 0.002" (0.0508mm) larger than the via hole diameter. The Au metal via wrap thickness can be 100–400µ" (2.5–10 microns).

  Enforced Hollow Plated Via-Wrap

Enforced Hollow Plated Via-Wrap

 
 

Polyimide Filled Vias

Via is filled with a non-conductive polyimide plug for via hole assemblies. The non-conductive plug will prevent epoxy and eutectic solders from reaching the surface of the circuit, while keeping continuity between the back side and front side surfaces.

  Polyimide Filled Vias

Polyimide Filled Vias

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