Polyimide Supported Bridges

Polyimide Supported Bridges (Poly Bridges) provide a dramatically improved alternative to traditional wire bonding or standard air bridges. Because bridge height, length and overall placement is very consistent and durable, optimum performance can be easily repeated which can minimize or eliminate test and tune time.

Polyimide Supported Bridge

Poly Bridges offer increased assurance over ordinary Air Bridges or bond wires because the bridge is maintained at a consistent height by the polyimide (3 to 6 microns), and keeps the bridge from collapsing, preventing unwanted electrical shorts.

Because the parts will be delivered to you with this type of consistent interconnect solution, assembly time can be minimized or eliminated.

Poly Bridges can also dramatically improve assembly yields by eliminating the shorts caused by traditional bond wire methods on very small interdigital structures, such as Lange Couplers.

ATP’s Team of CAD professionals are ready and willing to add these types of interconnect solutions to your existing designs.

 
Polyimide Properties
Tensile Strength Mpa 215
Young’s Modulus Gpa 2.5
Tensile Elongation % 85
Glass Transition Temperature °C 285
Thermal Decomposition Temperature °C 525
Coefficient of Thermal Expansion ppm/°C 55
Coating Stress (100 silicon) MPa 33
Dielectric Constant 1MHz; 0%/50% RH   3.2/3.3
Dissipation Factor 1MHz; 0%/50% RH   0.003/0.008
Dielectric Strength V/µm 345
Moisture Absorption @ 50% RH % 1.08
Density g/cc 1.39
Refractive Index @ 633nm   1.69

Please request document #DG50020 Design For Manufacturability, in PDF format (requires Adobe Reader).

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  Polyimide Bridge

Polyimide Bridge

Polyimide Bridge

Polyimide Bridge

Polyimide Bridge

Polyimide Bridge

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