Photo Masks, Computer-Aided Design (CAD) and Data Conversion Requirements

ATP has six Electro-Mask/T.R.E./ASET, two of which are Criss Cross Systems with Pattern Generators and Image Repeaters. Each system is fully self-contained in a class 100 environmentally controlled chamber. ATP is the only manufacturer in the United States that offers this combination of in-house mask making and substrate manufacturing.

In order to guarantee the highest quality circuits, ATP generates hard surface Photomasks produced on Precision Pattern Generated Equipment. ATP’s masks are all fabricated to precise tolerances, whether they are for engineering or manufacturing requirements. While Mylar or Emulsion films can be used to make thin-film circuits, they can often compromise the results. ATP has extensively invested in this capability to allow us to quickly and cost-effectively produce high quality glass masks to meet our customers’ needs.

Quick turn and pizza array (multi-part) engineering photomasks available.

Pattern Generator/Stepper

Pattern Generator/Stepper

CAD Services

CAD Services


ATP can generate Photomasks from the following formats

AutoCAD .DWG or .DXF files

Gerber photo plotter data

GDSII files

Dimensioned drawings

Electromask data

Rubylith artwork


Our CAD professionals are willing to lay out all of your engineering and prototype arrays. This will allow you to spend more time on designs, not the layouts. ATP routinely produces images in Chrome and Iron Oxide on high-quality soda lime glass. In addition, we have expertise in imaging on Photographic Emulsion. If you have an internal lab, let ATP create masks for you. We commonly stock 3"x3" (76.2mm x 76.2mm), 4"x4" (101.6mm x 101.6mm), 5"x5" (127.0mm x 127.0mm), 6"x6" (152.4mm x 152.4mm) and 8"x8" (203.2mm x 203.2mm) Soda Lime Glass.

CAD Data Guidelines

ATP has a talented team of CAD professionals to convert your CAD designs from specification control drawings (spec drawings) into the various documents needed for thin-film processing. To facilitate these documents, we request that you incorporate the following information and design guidelines in your CAD package so that we may accurately process your design:

1. Purpose

1.1. The purpose of these guidelines is to help ensure on time delivery and that each order will be built to specification.

2. Scope

2.1. This reference identifies simple CAD rules and methods that will communicate the design.

2.1.1. Note, some of the information below is specific to CAD software.

3. Referenced Documents

3.1. N/A

Figure One

Figure One

Figure Two

Figure Two

Figure Three

Figure Three

Figure Four

Figure Four

Figure Five

Figure Five

Figure Six

Figure Six

4. Data Guidelines

4.1. Please refer to ATP’s design guidelines and catalog specifications.

4.2. Provide CAD data scaled in INCHES.

4.3. Figure One shows a design that is all on one layer and one color. This is not clear and may be interpreted incorrectly. Please do not provide CAD data all on one layer.

4.4. Figure Two is clearer than Figure One. In Figure Two, each component of the design has been identified by color and layer. See below for a screenshot from this design. You can see that each component of the design was put on a layer that clearly identified the function of the holes, the Top Conductor (Gold), the resistor and the outline of the circuit.

4.5. Figure Three (preferred) is the same as Figure Two, except the metallized areas (resistor and Gold) have been clearly identified by a “hatch” pattern. This is very helpful.

5. Data Guidelines Two-Sided (double sided) circuit.

5.1. Double sided circuits have patterns on the top and bottom sides.

5.2. Figure Four clearly identifies the top and bottom patterns. See below the screen shot of the added bottom layer to help identify the CAD Data.

5.3. Figure Five is an example of a two sided design without vias.

5.4. Note the three different CAD views. Top and Bottom patterns are clearly shown as in Figure Four, but a third view (in CAD) has been added.

5.5. This new “Through View” is only needed in the CAD data, not in any Annotation drawings that are provided. This CAD data helps the CAD Drafter understand the bottom orientation relative to the top when via holes are not present or the design is not symmetric.

6. Annotation Guidelines

6.1. This section is provided to help the designer annotate a drawing. This information, if provided clearly, communicates the measurable design requirements.

6.2. Refer to Figure Six for the following:

6.2.1. Identify the outline of the circuit (X and Y dimensions).

6.2.2. Identify one resistor and the resistor value for heat treating.

6.2.3. State if the hole is Plated or Non-Plated.

6.2.4. If necessary, provide one dimension to verify the data file to the final metallized circuit (in this example the dimension is .0020 ±.0002). Provide a tolerance only if required for the design.

Figure Seven

Figure Seven

7. CAD Guidelines

7.1. CAD guidelines show how to structure the data for ease of fabrication (translating to artwork).

7.2. Refer to Figure Seven. Draw all patterns using closed joined polylines. All polylines should be zero width.

7.3. Draw in Model Space. No circuit data or circuit layers in Paper Space.

7.4. Notes and dimensions in Paper Space are fine.

7.5. No Xrefs, No elevation or thickness. Please do not use splines, ellipses or regions.

Figure Eight

Figure Eight

8. Text

8.1. Upon request, ATP can supply our customer with down-loadable AutoCAD Text that can be used in the data that will be supplied to ATP. This text is made of “closed joined polylines” and was created to work with our processing.

8.2. This text can be used to make any part number or text required on a circuit.

8.3. Refer to Figure Eight for a screenshot of the AutoCAD text available from ATP.

Company Technologies Capabilities Design Guidelines Products Other


Polyimide Supported Bridges


Standard Dimensions and Tolerances

Inductor Coils


Quality Assurance System

Solder Dams


Material and Conversion Tables

Inductor Coils Eng. Kit

Contact Us


Laser Diode Submounts (Au/Sn)

Material Specs

Thermal Performance

Microstrip Transmission Lines

Terms of Use


Vias: Plated Through

Laser Machining/Drilling-Vias

Aging Equation

Transmission Lines Eng. Kits

Privacy Policy

Sales Rep’s

Vias: Au or Cu Solid Filled

Backside Burnishing Treatment

Safe Current Limits

Stand Off/Isolation Pads


Contact Us

Edge Wraps


Design Resources

ATP Bond Qualification Coupons


Gold Bumping

Integrated TaN Resistors


Product Samples


Fractal Fasten

Laser Resistor Trimming


Packaging/Chip Trays