Material Specifications
Specifications are offered as an assistance to engineers and purchasing professionals in the design and procurement of thin-film circuit substrates.
| Chemical Composition |
Al2O3 |
Al2O3 |
Al2O3 |
BeO |
AlN |
SiO2 |
SiO2 |
A/C plane
—Al2O3 |
|
|
| Purity |
99.6% |
99.6% |
99.6% |
99.5% |
98% |
100% |
100% |
100% |
|
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| Color |
White |
White |
White |
White |
Tan |
Transparent |
Transparent |
Transparent |
Cream |
Gray |
| Nominal Density |
3.87g/cm3 |
3.87g/cm3 |
3.95g/cm3 |
2.85g/cm3 |
3.28g/cm3 |
2.2g/cm3 |
2.65g/cm3 |
3.97g/cm3 |
|
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| Surface Finish
(Polished) CLA |
< 1.0µ"
(25nm) |
|
< 1.0µ"
(25nm) |
2.0–4.0µ"
(50–100nm) |
< 2.0µ"
(50nm) |
60/40
Optical |
60/40
Optical |
< 1.0µ"
(25nm) CLA |
< 3.0µ"
(76nm) |
< 16.0µ"
(400nm) |
| Surface Finish
(Asfired) CLA |
|
3–4µ"
(76–101 nm) |
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| Camber |
0.0003–0.0005"
(76nm–152nm) |
0.002"
(0.0508mm) |
|
0.0003–0.0005"
(76nm–152nm) |
0.0003–0.0005"
(76nm–152nm) |
0.0003–0.0005"
(76nm–152nm) |
0.0003–0.0005"
(76nm–152nm) |
0.0003–0.0005"
(76nm–152nm) |
0.002"
(0.0508mm) |
0.002"
(0.0508mm) |
| Thickness |
0.004–0.080"
(0.100–2.0mm) |
0.005–0.025"*
(0.127–0.635mm) |
|
0.005–0.025"*
(0.127–0.635mm) |
0.004–0.080"
(0.100–2.0mm) |
0.004–0.025"*
(0.100–0.635mm) |
0.004–0.025"*
(0.100–0.635mm) |
0.004–0.025"*
(0.100–0.635mm) |
0.005–0.025"*
(0.127–0.635mm) |
0.010–0.025"
(0.254–0.635mm) |
| Thickness Tolerance |
±0.0005"
(±0.0127mm) |
±0.001"
(±0.0254mm) |
|
±0.0005"
(±0.0127mm) |
±0.0005"
(±0.0127mm) |
±0.0005"
(±0.0127mm) |
±0.0005"
(±0.0127mm) |
±0.0005"
(±0.0127mm) |
±0.0005"
(±0.0127mm) |
±0.0005"
(±0.0127mm) |
| Process Sizes (L&W) |
1.0–4.0"
(25.4–101.6mm) |
1.0–6.0"
(25.4–152.4mm) |
|
1.0–4.00"
(25.4–101.6mm) |
1.0–4.00"
(25.4–101.6mm) |
1.0–3.00"
(25.4–76.2mm) |
1.0–3.00"
(25.4–76.2mm) |
1.0–2.25"
(25.4–57.15mm) |
1.0–2.25"
(25.4–57.15mm) |
1.0–2.25"
(25.4–57.15mm) |
| Coefficient of Thermal
Expansion (CTE) |
7.0–8.3
x 106
(25–1000°C) |
7.0–8.3
x 106
(25–1000°C) |
8.2
x 106
(25–1000°C) |
9.0
x 106
(25–1000°C) |
4.6
x 106
(25–300°C) |
0.55
x 106
(20–320°C) |
|
A plane
@ 25°C—5.3 |
|
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| Thermal Conductivity |
26.9
Watts/m°K |
26.9
Watts/m°K |
35
Watts/m°K |
270
Watts/m°K
325
Watts/m°K |
170
Watts/m°K
200
Watts/m°K |
1.38
Watts/m°K |
|
42
Watts/m°K |
|
|
| Dielectric Constant (k) |
9.9
@ 1 MHz |
9.9
@ 1 MHz |
10.0
@ 1 MHz |
6.76
@ 1 MHz |
8.6
@ 1 MHz |
3.826
@ 1 MHz |
4.6 parallel
4.5 perpendicular |
11.5/9.3
@ 1 MHz † |
36–180
@ 1 MHz |
14.5–17.6
@ 1 MHz |
| Dissipation Factor
(Loss Tangent) |
0.0001
@ 1 MHz |
0.0001
@ 1 MHz |
0.0001
@ 1 MHz |
0.0004
@ 1 MHz |
0.001
@ 1 MHz |
0.000015
@ 1 MHz |
|
0.00086/0.0003
@ 1 MHz † |
|
|
| Dissipation Factor
(Loss Tangent) |
0.0002
@ >10 GHz |
0.0002
@ >10 GHz |
0.0001
@ >10 GHz
|
|
0.002 @
>10 GHz |
|
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| Q |
5000
@ 1 GHz |
5000
@ 1 GHz |
5000
@ 1 GHz |
|
5000
@ 1 GHz |
|
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|
Hardness
(Rockwell)
|
87 |
87 |
87 |
60 |
|
7 Mohs |
7 Mohs |
1800/2200A
Knoop |
|
|
| Flexural Strength |
90 x 103
K lbs/in2 |
90 x 103
K lbs/in2 |
99 x 103
K lbs/in2 |
35 x 103
K lbs/in2
(3 pt. bend) |
59 x 103
K lbs/in2
(4 pt. bend) |
25 x 103
K lbs/in2 |
|
60 x 103
K lbs/in2 |
|
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| Compressive Strength |
54 x 103
M lbs/in2 |
54 x 103
M lbs/in2 |
|
|
|
161 x 103
M lbs/in2 |
|
350 x 103
M lbs/in2 |
|
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| Grain Size |
< 1.0µm |
< 1.0µm |
< 1.0µm |
14–22µm |
5–7µm |
Amorphous |
single crystal |
single crystal |
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* Additional thicknesses and tolerances available upon request.
† Value varies with orientation (“A” plane / “C” plane)
Disclaimer
ATP has made every effort to have this information as accurate as possible. However no responsibility is assumed by ATP for its use, nor for any infringements of rights of third parties which may result from its use. ATP reserves the right to revise the content or modify its product without notice.
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Download the Material Specs in PDF format. (Requires Adobe Reader.)
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