Laser Machining/Drilling-Vias

Our computer-controlled lasers can create features of virtually any planar shape and can deliver positional accuracies of 0.001" (0.0254mm) or better over areas as large as 8"x8" (203.2mm x 203.2mm). The laser is extremely flexible and permits close location of features with considerable layout flexibility.


Dual Beam Lasers

Machined Features/Special Shapes

Special Shapes

Virtually any planar shape can be cut in ceramic substrates. These shapes include circles, curves, rectangles, polygons, rounded thin slots, etc. Since ceramics are strong but brittle, the designer should consider a radius as large as practical on the inside corners. All inside corners will need to have a minimum of 0.003" (0.0762mm) radius due to the laser beam diameter. Rounding inside corners can reduce chipping and cracking. Laser machining next to conductor lines should be pulled back from edge by 0.001" or 0.0254mm minimum.


Types of Ceramic Materials

Materials covered include Alumina, Beryllium Oxide, Aluminum Nitride, Ferrite and Fused Silica/Quartz.


High temperature annealing for Alumina-based substrates is also offered. This can increase ceramic flexural strength, improve adhesion and reduce internal stresses.

Handling and Cleaning

Laser protective coating is applied to protect material surface finishes and parts during the laser process. Laser protective coating also guards against adhesion of “slag” to material surfaces. Slag buildup is primarily found on the beam exit side of the substrate and is removed after laser processing.


Tolerances for Machining/Drilling

The tolerances provided here will generally produce the most cost effective laser processing. Tighter tolerances can be achieved at an increase in cost and lead time. Spacing between via holes should be a minimum of one via diameter. Typical laser diameter is 0.00375" (0.095mm).

Other taper and diameter tolerances available upon request. Please contact our sales department for more information.

Substrate Thickness Typical Taper Typical Diameter Tolerance Typical Diameter
0.003" (0.0762mm) 0.00075" (0.0190mm) ±0.00075" (0.0190mm) 0.004" (0.101mm)
0.004" (0.101mm) 0.00075" (0.0190mm) ±0.00075" (0.0190mm) 0.004" (0.101mm)
0.005" (0.127mm) 0.001" (0.0254mm) ±0.001" (0.0254mm) 0.005" (0.127mm)
0.010" (0.254mm) 0.001" (0.0254mm) ±0.001" (0.0254mm) 0.010" (0.254mm)
0.015" (0.381mm) 0.0015" (0.0381mm) ±0.0015" (0.0381mm) 0.015" (0.381mm)
0.020" (0.508mm) 0.002" (0.0508mm) ±0.002" (0.0508mm) 0.020" (0.508mm)
0.025" (0.635mm) 0.0025" (0.0635mm) ±0.0025" (0.0635mm) 0.025" (0.635mm)
Company Technologies Capabilities Design Guidelines Products Other


Polyimide Supported Bridges


Standard Dimensions and Tolerances

Inductor Coils


Quality Assurance System

Solder Dams


Material and Conversion Tables

Inductor Coils Eng. Kit

Contact Us


Laser Diode Submounts (Au/Sn)

Material Specs

Thermal Performance

Microstrip Transmission Lines

Terms of Use


Vias: Plated Through

Laser Machining/Drilling-Vias

Aging Equation

Transmission Lines Eng. Kits

Privacy Policy

Sales Rep’s

Vias: Au or Cu Solid Filled

Backside Burnishing Treatment

Safe Current Limits

Stand Off/Isolation Pads


Contact Us

Edge Wraps


Design Resources

ATP Bond Qualification Coupons


Gold Bumping

Integrated TaN Resistors


Product Samples


Fractal Fasten

Laser Resistor Trimming


Packaging/Chip Trays