Backside Burnishing Treatment

ATP continues to offer a backside burnishing treatment that will minimize burrs, tails and post laser slags on the backside of substrates. This treatment can be used when laser cutting through gold on backsides of substrates. This cost effective process could also improve adhesion and eliminate the need for customers to “roughen up” the surface of the components themselves before epoxy bonding.

Backside burnishing treatment should not be confused with ATP’s Fractal Fasten technology, see Fractal Fasten technology page. Please contact ATP Sales for further information on the Backside Burnishing Treatment.

Backside Burnishing Treatment
Company Technologies Capabilities Design Guidelines Products Other


Polyimide Supported Bridges


Standard Dimensions and Tolerances

Inductor Coils


Quality Assurance System

Solder Dams


Material and Conversion Tables

Inductor Coils Eng. Kit

Contact Us


Laser Diode Submounts (Au/Sn)

Material Specs

Thermal Performance

Microstrip Transmission Lines

Terms of Use


Vias: Plated Through

Laser Machining/Drilling-Vias

Aging Equation

Transmission Lines Eng. Kits

Privacy Policy

Sales Rep’s

Vias: Au or Cu Solid Filled

Backside Burnishing Treatment

Safe Current Limits

Stand Off/Isolation Pads


Contact Us

Edge Wraps


Design Resources

ATP Bond Qualification Coupons


Gold Bumping

Integrated TaN Resistors


Product Samples


Fractal Fasten

Laser Resistor Trimming


Packaging/Chip Trays