Material and Conversion Tables

Thermal Conductivity
METALS (Watts cm °C)
Silver (Ag) 4.08
Copper (Cu) 3.94
Gold (Au) 2.96
Aluminum (Al) 2.18
Beryllium (Be) 2.00
Tungsten (W) 1.74
Rhodium (Rh) 1.50
Molybdenum (Mo) 1.46
Brass (66% Cu, 34% Zn) 1.110
Chromium (Cr) 0.937
Nickel (Ni)  0.920
Platinum (Pt) 0.716
Tin (Sn) 0.666
Tantalum (Ta) 0.575
Lead (Pb) 0.353
Titanium (Ti) 0.219
Manganese (Mn) 0.078
INSULATORS (Watts cm °C)
Diamond (CVD) 10.0-16.0
Beryllium Oxide 99.5% (BeO) 2.61
Aluminum Nitride (AIN) 1.70
Boron Nitride (HBN 500°) 0.59
Sapphire   0.46
Alumina Oxide 99.6% (AI2O3) 0.36
Alumina Oxide 96% (AI2O3) 0.26
Alumina Oxide 91% (AI2O3) 0.13
Glass   0.015
Mica   0.0043-0.0062
Air   0.00026
BONDING (Watts cm °C)
Gold Germanium 88/12 0.883
Gold Tin 80/20 0.682
Tin Lead Solder (Sn62) 0.492
Indium 100% 0.239
Silver Filled Epoxy 0.016
Epoxy 0.010
Temperature Conversion
Degrees F = 9 / 5 (Degrees C) + 32
Degrees C = 5 / 9 (Degrees F) - 32
Gold Conversion
EQUIVALENTS
1 Kilogram = 32.15 Troy Ounces
1 Troy Ounce = 31.103 Grams
1 Pound = 453.59 Grams
1 Pound = 14.583 Troy Ounces
24 Karats is 100% Gold
18 Karats is 75% Gold
14 Karats is 58.33% Gold
10 Karats is 41.66% Gold

Download the Material and Conversion Tables in PDF format. (Requires Adobe Reader.)

 
Solders
COMPOSITION MELTING RANGE
SOLIDUS LIQUIDUS
Sn96 221°C 221°C
Sn70 182°C 193°C
Sn63 182°C 182°C
Sn62 176°C 189°C
Sn60 182°C 190°C
Sn50 182°C 215°C
Sn40 182°C 238°C
Sn35 182°C 246°C
Sn30 182°C 254°C
Sn20 182°C 276°C
Sn10 267°C 299°C
Sn5 308°C 312°C
Sb5 232°C 240°C
Pb80 182°C 276°C
Pb70 182°C 254°C
Pb65 182°C 246°C
Ag1.5 309°C 309°C
Ag2.5 304°C 304°C
Ag5.5 304°C 365°C
Gold Germanium
(88/12)
356°C 356°C
Gold Tin
(80/20)
280°C 280°C
Indium (100%) 157°C 157°C
Electrical Conductivity
MATERIAL ELECTRICAL
CONDUCTIVITY
(Siemens/m)
Aluminum 3.538x107
Beryllium 2.256x107
Brass
(66%Cu, 34%Zn)
2.564x107
(converted from
resistivity)
Carbon (graphite) 1.276x105
Chrome 5.104x106
Copper 5.800x107
Gold 4.257x107
Indium 1.392x107
Lead 4.872x106
Nickel 1.462x107
Palladium 9.280x106
Platinum 9.442x106
Rhodium 2.227x107
Silver 6.090x107
Tin 8.700x106
Tin Lead Solder
(63/37)
7.284x106
(estimated)
Titanium 1.276x106
Titanium Tungston
(TiW)
1.652x107
(estimated)
Tungsten 1.821x107
Copper Thickness Conversion
WEIGHT THICKNESS
½ Ounce 0.7 Mils 17.8 Microns
1 Ounce 1.4 Mils 35.6 Microns
2 Ounces 2.8 Mils 71.1 Microns
3 Ounces 4.2 Mils 106.7 Microns

 

 
Other Conversions
EQUIVALENTS
1 Micron = 39.37 Microinches
1 Micron = 10,000 Angstroms
1 Micron = 1,000 Nanometers
25.4 Microns = 1 Mil
1 Angstrom = 0.003937 Microinches
1 Angstrom = 0.0001 Microns
10 Angstroms = 0.03937 Microinches =
1 Nanometer
50 Angstroms = 0.1968 Microinches =
60/40 Optical
254 Angstroms = 1 Microinch
100 Nanometers = 3.937 Microinches
100 Nanometers = 1,000 Angstroms
1 Nanometer = 10 Angstroms
1 Microinch = 254 Angstroms
1 Microinch = 25.4 Nanometers
39.37 Microinches = 1 Micron
1 Mil = 25.4 Microns
TO GET MULTIPLY BY
Angstroms = Microns x 10,000
Angstroms = Microinches x 254
Angstroms = Mils x 25,400
Angstroms = Nanometers x 10
Microns = Nanometers x 0.001
Microns = Angstroms x 0.0001
Microns = Microinches x 0.0254
Microns = Mils x 25.4
Microns = Millimeters x 0.01
Nanometers = Microns x 1000
Nanometers = Mils x 0.03937
Nanometers = Microinches x 25.4
Nanometers = Angstroms x 0.10
Millimeters = Microns x 0.001
Millimeters = Mils x 0.0254
Millimeters = Microinches x 0.0000254
Millimeters = Inches x 25.4
Centimeters = Inches x 2.54
Centimeters = Millimeters x 10
Microinches = Microns x 39.37
Microinches = Mils x 1000
Microinches = Angstroms x 0.003937
Microinches = Nanometers x 0.03937
Microinches = Millimeters x 39.373
Mils = Microns x 0.03937
Mils = Microinches x 0.001
Mils = Angstroms x 254,000
Mils = Millimeters x 39.37
Inches = Millimeters x 0.03937
Inches = Centimeters x 0.3937
Sq. Inches = Sq. Centimeters x 0.15499
Sq. Centimeters = Sq. Inches x 6.45
Cu. Inches = Cu. Centimeters x 0.06102
Cu. Centimeters = Cu. Inches x 16.39
Ounces = Grams x 0.03527
Pounds = Kilograms x 2.2046
Grams = Ounces x 28.349
Kilograms = Pounds x 0.4536
 
 
 
 
 
 
Company Technologies Capabilities Design Guidelines Products Other

Introduction

Polyimide Bridges

Photomasks

Standard Dimensions, Tolerances

Inductor Coils

Home

Quality Assurance

Solder Dams

Substrates

CAD Data Guidelines

Inductor Coils Eng. Kit

Contact Us

Directions

Laser Diode Submounts

Material Specifications

Material and Conversion Tables

Microstrip Transmission Lines

Careers

Careers

Vias: Plated Through

Ion Beam

Thermal Performance

Transmission Lines Eng. Kits

Terms of Use

Sales Rep’s

Vias: Au or Cu Solid Filled

Aluminum Bonding Pads

Aging Equation

Stand Off/Isolation Pads

Privacy Policy

Contact Us

Edge Wraps

Laser Machining/Drilling

Safe Current Limits

ATP Bond Qualification Coupons

Facebook

 

Gold Bumping

Backside Burnishing

Design Resources

Product Samples

YouTube

 

Fractal Fasten

Standard Metallizations

 

Packaging/Chip Trays

 
   

Integrated TaN Resistors

 

Thin Film Resistor and Multi-Tap

 
   

Laser Resistor Trimming

     
   

Serialization