A division of Vishay Intertechnology, Inc.
CALL ATP AT 510.661.4287
Backside Burnishing Treatment
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ATP continues to offer a backside burnishing treatment that will minimize burrs, tails and post laser slags on the backside of substrates. This treatment can be used when laser cutting through gold on backsides of substrates. This cost effective process could also improve adhesion and eliminate the need for customers to “roughen up” the surface of the components themselves before epoxy bonding. Backside burnishing treatment should not be confused with ATP’s Fractal Fasten technology, see Fractal Fasten technology page. Please contact ATP Sales for further information on the Backside Burnishing Treatment. |
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