ATP offers a wide variety of Stand Off/Isolation Pads to aid our customers in their hybrid assembly processing. Stand Offs and Isolation Pads can be used in a variety of ways depending on the metal scheme ordered. They can be used as a capacitive standoff, component mounting isolation pad, landing pads to reduce bond wire and DC bias wire lengths, gap pedestals for aligning component heights and many other useful configurations. Note: ATP’s Stand-Off/Isolation Pads are off the shelf quick turn parts inspected to our commercial grade inspection criteria (WSS71-02). If a tighter inspection criteria is required then please let ATP Sales know at the time of quoting. Note: On occasion these parts may exhibit burrs by design and no burrs is required, then please contact ATP Sales for a custom solution. |
Material: Asfired Alumina 99.6% and Aluminum Nitride is available. Metallization front and back sides: TiW = 300–800Å (0.03µm–0.08µm) Au = 120µ" (3 microns) minimum Delivery: 24–48 hours (in-stock lengths only) ATP will guarantee to MIL-STD-883, Method 2011.10, Test Condition D, using a 1mil wire, on ATP standard products. |
Request a quote for the ATP Stand Off/Isolation Pads. Indicate the quantities below, then submit your RFQ with the Request For Quote button, below. |
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ATP Standoffs Parts ListPart number definition = |
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