Serialization

Today, many industries/applications require permanent identification marks, such as serialized part numbers. Currently, hard substrates can be serialize by photolithography and etching or by laser scribing.

Applied Thin-Film Products (ATP) offers a variety of serialization methods to meet our customers’ needs. The table at right provides a quick summary of each type of serialization ATP can offer. Please contact ATP Sales to determine which method is best for your application. ATP recommends that customers also provide the serialization range (range of serialization numbers you would like in your design).

Notes:
• Due to potential yield loss, ATP will provide the quantity of serialized circuits purchased. However, each sequential number in the range may not be shippable after processing.
• Additional lead times shall be required based on the serialization method chosen.

 
Method Min. Character
Height
Cost Limitations / Notes
Photolithography (Mask)

0.004"
(0.1016mm)

Least
Cost Effective

Masks Required.
Requires a NRE set-up fee and masks for each order. Additional one week to the delivery also required.

CO2 Laser

0.020"
(0.508mm)

Somewhat
Cost Effective

Internal CAD work required for each order.
Best on bare substrate material.
Requires a NRE set-up fee for each order.

YAG Laser onto
Titanium-Tungsten (TiW) pad

0.010"
(0.254mm)

Cost Effective

Requires NRE TiW mask.
Requires a NRE set-up fee for each order.

YAG Laser onto Au (Au)

0.010"
(0.254mm)

Cost Effective

Requires special processing.
Requires a NRE set-up fee for each order.


Photolithography (Mask) Serialization
(See Figures 1 and 2)

The photolithography process will require a photo mask for each substrate ATP processes. Each character is a separate pattern strung together to create the serial number for every circuit (each individual serial number). Mask serialization is available on any metal or pattern.

The line edge quality of this serialization method will be the best but can also be the least cost effective in terms of manufacturing due to the requirement of a unique mask to be produced for a number series. In addition, extensive CAD time may be required.

Figure 1: Photolithography (Mask) Serialization

Figure 1: Photolithography (Mask) Serialization

Figure 2: Photolithography (Mask) Serialization

Figure 2: Photolithography (Mask) Serialization

 

CO2 Laser Serialization
(See Figures 3 and 4)

The CO2 laser can be used when serialization is required directly onto the substrate material.  This method requires the largest footprint and has character resolution limitations. CO2 laser serialization can be somewhat cost effective but may still require additional CAD time.

Figure 3: CO2 Laser Serialization

Figure 3: CO2 Laser Serialization

Figure 4: CO2 Laser Serialization

Figure 4: CO2 Laser Serialization

 

YAG Laser Serialization
(See Figures 5 and 6)

YAG Laser serialization can be performed either on a Titanium-Tungsten (TiW) pad or directly onto Gold (Au). Both methods can be cost effective but additional NRE tooling for an additional photomask is required to process on the Titanium-Tungsten (TiW) pad. YAG laser onto Gold (Au) also requires special processing.

Figure 5: YAG Laser onto Titanium-Tungsten (TiW)

Figure 5: YAG Laser onto Titanium-Tungsten (TiW) pad with no gold. Note the color of the TiW is caused by oxidation from heat treating.

Figure 6: YAG Laser onto Gold (Au)

Figure 6: YAG Laser onto Gold (Au) using an ATP proprietary process

Company Technologies Capabilities Design Guidelines Products Other

Introduction

Polyimide Bridges

Photomasks

Standard Dimensions, Tolerances

Inductor Coils

Home

Quality Assurance

Solder Dams

Substrates

CAD Data Guidelines

Inductor Coils Eng. Kit

Contact Us

Directions

Laser Diode Submounts

Material Specifications

Material and Conversion Tables

Microstrip Transmission Lines

Careers

Careers

Vias: Plated Through

Ion Beam

Thermal Performance

Transmission Lines Eng. Kits

Terms of Use

Sales Rep’s

Vias: Au or Cu Solid Filled

Aluminum Bonding Pads

Aging Equation

Stand Off/Isolation Pads

Privacy Policy

Contact Us

Edge Wraps

Laser Machining/Drilling

Safe Current Limits

ATP Bond Qualification Coupons

Facebook

 

Gold Bumping

Backside Burnishing

Design Resources

Product Samples

YouTube

 

Fractal Fasten

Standard Metallizations

 

Packaging/Chip Trays

 
   

Integrated TaN Resistors

 

Thin Film Resistor and Multi-Tap

 
   

Laser Resistor Trimming

     
   

Serialization